摘要
对陶瓷与金属Ti Ag Cu活性法出现的Ti Ag Cu活性合金焊料在不同金属表面的流散性进行了分析 ,解释了用Ti Ag Cu活性合金焊料焊接陶瓷和金属时不能达到真空气密的原因 ;同时 。
In this paper, the blushing of melted Ti-Ag-Cu alloys on the surfaces of different metals was examined, and the reasons which resulted in nonvacuum-ti ghtness ceramic to metal joints was discussed. Also, the active brazing method t hat involves forming Ti film on ceramic surface by sputtering was investigated.
出处
《真空电子技术》
2003年第4期51-53,共3页
Vacuum Electronics
