摘要
利用阳极氧化方法研制了应用于高密度封装中的铝金属基板。对其性能进行了测量。结果表明 ,在草酸电解液中获得的阳极氧化铝基板的膜层具有良好的电阻率 ,可达到 1× 10 1 4～ 1× 10 1 5Ω·cm数量级。其介电常数低于 10 ,随氧化膜层厚度增加而减小。对膜层进行的后续封孔处理提高了膜层的绝缘性能及耐蚀性。
Anodizing was employed to develop Al metal substrate applied for electronic packaging. The property measurements show that, Al substrate which is anodized in Oxalic solution has a high resistivity in the order of 1×10 14 ～1×10 15 Ω·cm. The dielectric constant of anodic film is below 10, and decreases with the film thickening. The insulated performance and corrosion resistance of anodic film are mprovied by seal treatment. The resistance to thermal shock of anodized Al substrate is enhanced by increasing the electrolyte temperature during the anodization process.
出处
《稀有金属》
EI
CAS
CSCD
北大核心
2003年第3期335-338,共4页
Chinese Journal of Rare Metals
基金
教育部留学回国人员科研启动基金资助项目
