摘要
电子器件的封装技术是制约集成电路发展的关键环节之一。封装中各材料(基底、粘结层、芯片及封装材料)的几何尺寸、材料性能的差异引起的翘曲问题严重影响芯片的可靠性和焊接性能。本文采用数值分析方法,并考虑玻璃态转化温度(Tg)对材料性能(弹性模量和热膨胀系数)的影响,研究了尺寸变化对芯片翘曲的影响。分析表明基底与芯片厚度比和封装材料与芯片厚度比的变化对翘曲的影响较大,基底与芯片面积比和粘结层与芯片高度比的变化对整体翘曲的影响较小,本文结果为进一步封装设计提供理论依据。
Electronic package plays an important role in integrate circuit. The reliability and the solderability of electronic package are significantly affected by the warpage resulted from the mismatch of material properties, such as Young＇s modulus, Poisson＇s ratio and coefficient of thermal expansion and the geometrical structure of each component for electronic package. The effectiveness of Glass Transition Temperature on material properties was considered. The numerical analysis results are applicable to the practical design of reliable electronic package.
出处
《力学季刊》
CSCD
北大核心
2005年第3期506-510,共5页
Chinese Quarterly of Mechanics
基金
香港科技大学资助项目
关键词
电子封装
有限元
几何尺寸
翘曲
electronic package
numerical analysis
geometrical structure
warpage
