摘要
通过模拟仿真与工程试验相结合的方法,系统研究了半包封与全包封结构在散热性能上的差异,重点探讨了塑封料导热性对芯片热管理的影响。研究结果表明,半包封结构在导热性能上显著优于全包封结构;塑封料的导热性越高,越有利于全包封结构降低结壳热阻和芯片结温,从而有效提升芯片的散热性能。通过对比不同导热系数的塑封料对芯片结温的影响,进一步验证了高导热塑封料在高功率芯片应用中的优势。通过仿真分析手段能够有效预测塑封料与芯片设计的匹配度,为优化塑封料性能提供了重要的理论依据和实践指导,对提升高功率芯片的可靠性和使用寿命具有重要意义。
This study investigates the thermal performance of semi-encapsulated and fully-encapsulated packaging structures.To combine finite element simulation with experimental validation,focusing on how molding compound thermal conductivity affects chip thermal management.Results show that semi-encapsulated structures outperform fully-encapsulated ones in thermal performance.Higher thermal conductivity in molding compounds improves thermal dissipation in fully-encapsulated structures.It reduces both junction-to-case thermal resistance and chip junction temperature.By comparing molding compounds with different thermal conductivity,confirming the benefits of high-thermal-conductivity materials for high-power chips.The simulation effectively predict the compatibility between molding compounds and chip designs.This provides key theoretical insights and practical guidance for optimizing molding compound performance.These findings enhance the reliability and extend the operational lifespan of high-power chips.
作者
邵志峰
邹洪生
邹振兴
邱松
于兆鹏
李进
SHAO Zhifeng;ZOU Hongsheng;ZOU Zhenxing;QIU Song;YU Zhaopeng;LI Jin(China Resources Microelectronics Co.,Ltd.,Wuxi 214061,China;Eterkon Semiconductor Materials Co.,Ltd.,Kunshan 215301,China)
出处
《电子工业专用设备》
2025年第5期36-41,72,共7页
Equipment for Electronic Products Manufacturing
关键词
塑封料
高导热
结壳热阻
仿真分析
封装结构
Molding compound
High thermal conductivity
Junction-to-case thermal resistance
Simulation analysis
Packaging structure
