摘要
针对模拟集成电路在温度循环应力下的封装退化过程进行了研究。设计了对应的加速退化试验,并根据其加速应力模型拟合分析了试验数据,得到了加速退化方程,推算出了日常应用条件下器件的贮存寿命。
The packaging degradation process of analog integrated circuits under temperature cycling stress is studied,and the corresponding accelerated degradation testing is designed.According to its accelerated stress model,the test data are fitted and analyzed,and the accelerated degradation equation is obtained.Based on this,the storage life of the device under daily application conditions is derived.
作者
李涛
吴兆希
LI Tao;WU Zhaoxi(The Military Representative Office of Air-force in Chongqing,Chongqing 400060,China;No.24 Research Institute of CETC,Chongqing 400060,China)
出处
《电子产品可靠性与环境试验》
2019年第4期11-14,共4页
Electronic Product Reliability and Environmental Testing
关键词
模拟集成电路
温度循环应力
封装失效
加速退化试验
analog IC
temperature -cycle stress
package failure
accelerated degradation testing
