摘要
集成电路作为现代信息技术的基石,其制造过程高度依赖光刻胶、封装材料、湿电子化学品和电子气体等关键电子化学品。近年来,在政策支持和产业需求双重推动下,我国电子化学品国产化进程取得显著成效,但在高端产品领域的仍存在技术壁垒和供应链安全风险。本文系统梳理了光刻胶、封装材料、湿电子化学品和电子气体的国产化进展,深度分析了当前面临的技术瓶颈与产业链协同挑战,并提出加强产学研合作、突破关键原料设备与配套等建议,以期为我国电子化学品发展提供参考。
Integrated circuits,the cornerstone of modern information technology,rely on electronic chemicals in the manufacturing process,including photoresists,packaging materials,wet electronic chemicals,and electronic gases.In recent years,with the attention and support of the state for the semiconductor industry,remarkable progress has been made in the localization process of these key materials,yet many challenges still remain.This paper systematically reviews the localization technology progress of photoresists,packaging materials,wet electronic chemicals,and electronic gases,deeply analyzes the current technical bottlenecks and industrial chain coordination challenges,and puts forward suggestions such as strengthening industry-university-research cooperation and breaking through key raw materials and equipment,providing a reference for the development of domestic electronic chemicals.
作者
李静静
LI Jingjing(Sinopec Engineering Incorporation,Beijing 100101,China)
出处
《山东化工》
2025年第16期67-69,共3页
Shandong Chemical Industry
关键词
集成电路
电子化学品
国产化
光刻胶
封装材料
湿电子化学品
电子气体
integrated circuit(IC)
electronic chemicals
localization
photoresist
packaging materials
wet electronic chemicals
electronic gases
