摘要
为了提高热电式微波功率检测芯片测量精度,提出了一种基于跷跷板结构的MEMS微波功率检测芯片。通过在热电式微波功率检测芯片上集成一个跷跷板结构的悬臂梁,采用直流电压表征输入的微波功率信号,使得信号检测不易受到外围电路和噪声等的干扰,提高了微波功率信号的测量精度。建立了热电式微波功率检测芯片的灵敏度模型,并据此分析衬底刻蚀厚度和热电偶长度对芯片灵敏度的影响。测试结果表明,在8~12 GHz频率范围内,芯片的回波损耗小于−27 dB,具有良好的微波特性。芯片热电式灵敏度的测试值为2.2 V/W@8 GHz、2.9 V/W@10 GHz、1.7 V/W@12 GHz。提出的基于跷跷板结构的微波功率检测芯片提高了信号的测量精度,对于热电式MEMS微波功率检测芯片的设计具有一定的参考价值。
To improve the measurement accuracy of thermoelectric microwave power detection,this study proposes a MEMS microwave power detection chip based on a seesaw structure.By integrating a cantilever beam in the form of a seesaw structure into the thermoelectric detection chip,a DC voltage is generated to represent the input microwave power.This approach reduces susceptibility to interference from peripheral circuits and noise,thereby enhancing the accuracy of microwave power signal detection.A sensitivity model for the thermoelectric microwave power detection chip is developed,and the effects of substrate etching depth and thermocouple length on chip sensitivity are analyzed.Measurement results show that the chip achieves a return loss better than−27 dB across the 8-12 GHz frequency range,demonstrating excellent microwave performance.The measured thermoelectric sensitivities are 2.2 V/W@8 GHz,2.9 V/W@10 GHz,and 1.7 V/W@12 GHz.The proposed seesaw-structured microwave power detection chip significantly improves signal measurement accuracy.The findings provides a valuable reference for the design of thermoelectric MEMS microwave power detection chips.
作者
凌宇恬
梁宇翔
王德波
LING Yutian;LIANG Yuxiang;WANG Debo(College of Integrated Circuit Science and Engineering,Nanjing University of Posts and Telecommunications,Nanjing 210023,P.R.China)
出处
《微电子学》
北大核心
2025年第3期455-459,共5页
Microelectronics
基金
国家自然科学基金青年资助项目(61904089)
江苏省自然科学基金青年资助项目(BK20190731)。
关键词
跷跷板结构
微波功率检测芯片
灵敏度
微波特性
see-saw structure
microwave power detection chip
sensitivity
microwave characteristics
