摘要
随着通信设备、服务器、路由器、无线基站等电子产品走向高速化,其对印制电路板(PCB)的材料也提出了更高要求。其中,覆铜板不断突破瓶颈,在树脂、玻璃布、铜箔、填料等方面不断取得创新与优化成果,开发出了一代又一代高速产品,使其电性能可满足不断提高的终端应用要求,但同时也给PCB加工带来了困扰。与传统材料相比,新型高速PCB材料在压合、钻孔、除胶特性等方面发生了较大变化,通常需要通过增加设备或采用特殊工艺才能加工制作。随着人工智能的高速发展,对其产品的算力和材料等级要求越来越高,因此越来越多的PCB进入到高速领域。为了更好地辅助解决高速PCB加工制造中的材料结构性问题,对各类高速PCB材料的加工失效模式进行分析,并提出相应的解决方案,以期为业界提供参考。
The communication infrastructure,High end servers,routers,wireless base stations,and other electronic products are moving towards high-speed development.Printed circuit boards(PCB)has put forward higher requirements for materials.In order to meet these electrical performance requirements,copper clad laminate continuously break through bottlenecks and optimize in resin,glass cloth,copper foil,fillers,and other aspects,developing generation after generation of high-speed products.The electrical performance can meet customer requirements,but it has brought significant difficulties to PCB processing.The characteristics of pressing,drilling,and debonding have undergone significant changes compared to traditional high-speed materials,In many cases,it is necessary to add equipment and use special methods to make high-speed boards good.With the further promotion of AI server products,the demand for computing power has increased,and the requirements for the grade of high-speed materials have also risen.More and more PCBS are entering the high-speed field.However,the processing technologies of various manufacturers vary greatly.To better assist PCBS in processing high-speed materials,we have conducted systematic research on the structural issues of high-speed products.Analyze and study the processing failure modes of various high-speed materials,and propose corresponding processing solutions,hoping to provide some references for the processing of high-speed materials in the industry。
作者
周才亮
王立峰
李鹏飞
ZHOU Cailiang;WANG Lifeng;LI Pengfei(Shengyi Technology Co.,Ltd.,Dongguan 523039,Guangdong,China)
出处
《印制电路信息》
2025年第8期12-17,共6页
Printed Circuit Information
关键词
高速印制电路板
覆铜板
失效模式
high-speed printed circuit board
copper clad laminate(CCL)
failure mode
