摘要
光模块光电子领域中的核心元器件,目前光模块的整体发展方向是:小型化、高速率、低功耗、低成本,这对光模块所用PCB带来了新的挑战。通过高精度阻抗控制、层间高精准对位技术、板边插头尺寸精准控制等技术,研发制作了一款应用于800 G光模块的高速PCB新产品,突破了上述技术难点;对产品进行了一系列可靠性指标检测,检测结果均为合格。
Optical module is the core optoelectronic device in the field of information optoelectronic technology,and the overall development direction of optical module is:miniaturization,high speed,low power consumption and low cost,which brings new challenges to the PCB used in optical module.In this paper,a new highspeed PCB product for 800 G optical modules has been developed through high-precision impedance control,highprecision interlayer alignment technology,and precise control of board plug size,which breaks through the technical difficulties.And a series of reliability index tests were carried out on the product,and the test results were qualified.
作者
蒲金灵
陈注佳
周文涛
宋建远
荣孝强
PU Jinling;CHEN Zhujia;ZHOU Wentao;SONG Jianyuan;RONG Xiaoqiang(Suntak Technology Co.,Ltd.,Shenzhen 518132,Guangdong,China)
出处
《印制电路信息》
2025年第8期42-46,共5页
Printed Circuit Information
关键词
800
G光模块
印制电路板
高速
800 G optical transceivers
printed circuit boards(PCB)
high speed
