摘要
随着AI服务器的普及和性能提升,对印制电路板的需求也在不断增加,要求印制电路板具有更高的布线密度。跨层盲孔作为高密度互连(HDI)工艺的核心技术之一,适用于高密度布局的电路板设计,可以最大限度利用印制板内部空间,减少外层走线,增加布线密度。跨层盲孔可以减少分布参数,有效改善信号完整性。本文针对关键技术点从工艺优化角度出发,结合可靠性测试结果,重点阐述了高纵深比激光跨层盲孔的制作方法、半填孔+POFV工艺解决盲孔平整性问题及孔壁与孔环实现互接等印制板加工关键技术,实现高纵深比激光跨层盲孔产品的开发。
With the growing adoption and performance improvements of AI servers,the demand for PCBs is steadily increasing,with requirements for higher wiring densities.As a core technology in HDI(high-density interconnect)processes,skip vias are ideal for high-density circuit board designs.They maximize the utilization of internal PCB space,reduce surfacelayer routing,and enhance wiring density.Additionally,skip vias minimize distributed parameters,effectively improving signal integrity.This paper focuses on key technical aspects from a process optimization perspective,combined with reliability test results.It provides an in-depth discussion on the fabrication methods for high aspect ratio(AR)laser skip vias,the semifilled via+POFV(plated-over-filled via)process to address skip via flatness issues,and critical PCB processing technologies to achieve interconnections between skip via walls and via pads.These advancements enable the development of high aspect ratio laser skip via PCB products.
作者
林辉
林旭荣
袁欢欣
朱彦瑞
Lin Hui;Lin Xurong;Yuan Huanxin;Zhu Yanrui
出处
《印制电路信息》
2025年第S1期263-268,共6页
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