摘要
在高速印制电路板(PCB)设计方面,主要介绍高速PCB板材的电性能发展趋势,如传输线结构和数据传输方式、布线设计非理想因素的影响机理以及芯片封装管脚排布要求,这些发展趋势可以有效提升高速数字系统的信号完整性与高速产品的运行可靠性。在高速PCB建模仿真方面,主要介绍传输线和过孔建模需要考虑的关键因素、如典型场景优化思路、材料各项异性表征方法实现阻抗、插损等电性能指标的仿测精度提升等,这些关键因素已被证实可满足当前224 Gbit/s高速系统的开发评估要求。
This article mainly focuses on the development trend and research progress of high-speed printed circuit board(PCB)design and simulation.In terms of design,it analyzes the development trend of electrical performance of high-speed PCB materials,transmission line structure and data transmission methods,the influence of non-ideal factors in high-speed PCB layout design,and the requirements for chip packaging pin layout,to effectively improve the signal integrity of high-speed digital systems and reliability of high-speed product operation;in terms of model-based simulation,the key points of transmission line and via modeling,optimization ideas for typical scenarios,and characterization methods for material anisotropy were analyzed to improve simulation-to-experiment accuracy on electrical performances such as impedance and insertion loss,therefore to meet the evaluation requirements for current 224 Gbps high-speed system development.
作者
朱文学
何骁
周波
张岩松
邓庚会
ZHU Wenxue;HE Xiao;ZHOU Bo;ZHANG Yansong;DENG Genghui(Reliability Research and Analysis Center,China Electronic Product Reliability and Environmental Testing Research Institute,Guangzhou 511370,Guangdong,China)
出处
《印制电路信息》
2025年第8期1-11,共11页
Printed Circuit Information
关键词
印制电路板
高速互连
信号完整性
差分信号
printed circuit board(PCB)
high speed interconnect
signal integrity
differential signaling
