摘要
随着电子技术的快速发展,对电子设备的性能要求越来越高。铝基板由于其良好的热导性、自重轻及成本较低的特点,在高性能电子设备中得到了广泛应用。然而,铝基板的PCB焊接工艺存在一些技术难题,如焊接性能不稳定、焊点质量难以控制等。鉴于此,研究了基于铝基板的PCB焊接工艺,通过试验论证焊接工艺参数,为提高铝基板PCB焊接质量提供了理论依据和实践指导。
With the rapid development of electronic technology,the performance requirements for electronic devices are becoming increasingly high.Aluminum substrates have been widely used in high-performance electronic devices due to their excellent thermal conductivity,light weight,and relatively low cost.However,there are some technical difficulties in the PCB soldering process of aluminum substrates,such as unstable soldering performance and difficult control of solder joint quality.In view of this,the PCB welding process based on aluminum substrate was studied,and the welding process parameters were experimentally demonstrated,providing theoretical basis and practical guidance for improving the welding quality of aluminum substrate PCB.
作者
张广泰
徐小飞
闫继豪
陆凯雷
彭晨
ZHANG Guangtai;XU Xiaofei;YAN Jihao;LU Kailei;PENG Chen
出处
《今日自动化》
2024年第10期103-105,共3页
Automation Today
关键词
铝基板
PCB焊接
焊接工艺参数
焊接质量
aluminum substrate
PCB soldering
welding process parameters
welding quality
