摘要
从铝基板的特性入手,对不同的厂家的产品进行了测试对比,并对铝基板与元器件的膨胀系数不匹配问题进行了分析。提出了优化焊盘结构和改变端电极的减缓应力的措施,并通过环境试验对不同安装方式下的焊点可靠性进行了验证。
The characteristics of A1-PCB substrate are tested and contrasted between different manufacturer＇s products. And the CTE mismatching of components and substrate is analyzed. The solutions are presented for decreasing the stress of soldering by optimizing the pad pattern and changing terminal structure. The reliability of different component mounting methods is validated by environmental stress test.
出处
《电子产品可靠性与环境试验》
2013年第6期55-59,共5页
Electronic Product Reliability and Environmental Testing
基金
铝基PCB板可靠性研究课题项目(Cast-5102012012)
关键词
铝基板
元器件
焊装
可靠性
metal AI-PCB substrate
component
mount
reliability
