摘要
再流焊接技术是表面贴装技术生产过程中的关键工序,再流焊接工艺过程直接影响电子产品质量。其中焊接过程各阶段的温度控制尤为重要,要合理设置各温区的温度,使炉膛内的焊接对象在传输过程中所经历的温度按合理的曲线规律变化,才能保证再流焊质量。
Reflow soldering is the key process in the process of surface mount technology. Process of technology in reflow soldering directly affects the quality of electronic products. Welding one of the various stages of the process temperature control is particularly important. To set the temperature a reasonable temperature, the object of the welding process in the transmission of the temperature experienced by a reasonable change in the law of the curve, which can guarantee the quality of reflow soldering.
出处
《热加工工艺》
CSCD
北大核心
2009年第15期118-120,共3页
Hot Working Technology
关键词
再流焊:温度曲线:控制
reflow soldering
temperature curve
control
