摘要
为了研究回流焊温度曲线对焊接缺陷产生的影响,同时研究在实际生产过程中温度曲线的设置如何以量化的方式代替传统的尝试式方式,本文主要从热效能的角度研究了回流焊温度曲线的升温区、保温区、回流区以及冷却区的温度时间变化,建立模型研究总热效能,并在保证这个值基本不变的条件下协调温度时间从而获得最优化的温度曲线,结合热效能和PCBA组装密度确定温度曲线的冷却速率,以焊接缺陷反推温度曲线设置的不足,结合热效能理念寻求解决办法。对焊膏的助焊剂活性从润湿力的角度研究导致缺陷的成因,并根据润湿力选择备选焊膏。
In order to study the impact of welding defects by the reflow profile,and study how to set the traditional trial way instead of the quantified way in the process of setting actual producible reflow profile,the temperature-time change of the preheating zone,soak zone,reflow zone,cool down zone of reflow profile were studied.The total thermal efficiency model was established,and the temperature-time was adjusted in order to acquire the optimum reflow profile under the condition of ensuring the value basically changeless and the cooling rate of reflow profile was determined by studying the thermal efficiency and print circuit board assembly,in the process of setting reflow profile shortcoming,and the solution method was sought by integrating the thermal efficiency.The causes for defects from the point of wetting force for the flux activity of solder paste were studied,the solder paste according to the wetting force was selected.
出处
《热加工工艺》
CSCD
北大核心
2011年第19期133-135,138,共4页
Hot Working Technology
基金
南京信息职业技术学院科研基金项目(YKJ10-014)
江苏省大学生创新实践性项目课题
关键词
温度曲线
回流焊
PCBA
热效能
temperature profile
reflow solder
PCBA
thermal efficiency
