摘要
聚甲基丙烯酸甲酯(PMMA)作为微流控芯片研制中常用的高分子材料,其键合封装工艺是制作微流控芯片的重要组成部分。为了简捷有效地实现PMMA间的键合封装,研究了一种可在普通实验室开展的便捷、低成本且高效的PMMA键合封装方法。通过正交试验设计深入研究了键合时间、温度以及压力对PMMA键合强度的影响,从而确定最优工艺参数组合。实验结果表明,在115℃,70 min,60 N条件下可实现4.44 MPa的键合强度,且微流路通道变形较小(小于10%),可满足常规PMMA微流控芯片键合封装的要求,并可在普通微流控实验室有效开展。
Polymethyl methacrylate （PMMA） is a common polymer used for microfluidic chips, which bonding process is essential for the making of microfluidic chips. In order to effectively achieve bonding PMMA in common laboratory, a convenient, low-cost and efficient PMMA bonding method was studied. Through orthogonal experimental design, the effects of bonding time, temperature and pressure on bonding strength of PMMA were investigated experimental results show that with bonding pressure of 60 N, less distortion （less than , so the optimum combination of process parameters was determined. The the bonding temperature of 115 ℃, the bonding time of 70 min and the the bonding strength of 4. 44 MPa can be reached and micro flow channel shave 10% ）. It can meet the requirements of conventional PMMA microfluidic chip bonding packaging, and can be effectively carried out in the general microfluidic laboratory.
出处
《塑料工业》
CAS
CSCD
北大核心
2018年第2期117-122,共6页
China Plastics Industry
基金
国家科技支撑计划项目(2015BAI01B14)
重庆市高等教育教学改革研究一般项目(173114)
重庆理工大学高等教研研究项目(2015YB27)
重庆理工大学研究生教育优质课程项目资助(yyk2017106)
