摘要
聚合物微流控芯片的热压成形中,温度、压力和时间是三个主要的工艺参数,其中温度对聚合物的粘弹性影响最大.研究了不同温度下,PMMA材料的蠕变特性,基于广义kelvin蠕变模型拟合材料的蠕变曲线,得到材料的蠕变柔量及延迟时间.根据材料的蠕变柔量与松弛模量推导出松弛模量;基于不同温度的蠕变曲线确定时温等效方程的参数,并基于粘弹性材料模型有限元仿真热压成形.仿真结果表明,热压温度在材料玻璃点以上的120℃进行热压,可以获得良好的结构填充,而在玻璃点温度,热压结构填充性差,图形复制精度差.热压实验表验证了该仿真结论.
Temperature, pressure and time are three major control conditions in hot embossing process, and temperature is the most important one. Creep experiments at several temperatures have been conducted to study the mechanical property of PMMA in this paper. General Kelvin model has been used to fit the creep curve of PMMA. The relaxation property was obtained from conversion between creep compliance and relaxation modulus. WLF equation parameters were obtained at reference temperature 105℃ by shifting the creep curve along time logarithm axis. Based on viscoelastic material model, simulation of hot embossing process was carried out. It is shown that good filling can be obtained at 120℃, and the filling at glass transition temperature represents bad replicative quality. The simulation result is proved by hot embossing experiments.
出处
《传感技术学报》
CAS
CSCD
北大核心
2006年第05B期2015-2017,2021,共4页
Chinese Journal of Sensors and Actuators
基金
辽宁省博士启动基金资助(20041073)
关键词
热压
蠕变
松弛
有限元分析
hot embossing
creep
relaxation
finite element analysis
