摘要
在微流控芯片的制作中,键合是关键技术之一,基片与盖片只有通过键合才能形成封闭的微通道,因此键合质量直接影响芯片的制作质量。对键合方法进行了分类,综述了目前已有的芯片键合技术及方法,分析了各种键合方法在制作质量、制作效率以及是否适用于批量化制作等方面的局限性,详细介绍了具有效率高、适合批量化生产等优点的超声波键合技术的研究进展。
In fabrication of microfluidic chips, bonding of substrate and cover is the procedure for formation of enclosed micro channels, and is one of the key techniques for fabrication of microfluidie chips, directly affects the quality of the fabricated products. Bonding methods and techniques were summarized, and the limitations of fabrication quality, efficiency and suitability for batch production in available bonding methods were analyzed. Finally, recent research on ultrasonic bonding method was introduced, which has high production efficiency and is suitable for batch production.
出处
《中国机械工程》
EI
CAS
CSCD
北大核心
2008年第24期3012-3018,共7页
China Mechanical Engineering
基金
国家自然科学基金资助项目(50775024)
教育部新世纪优秀人才支持计划资助项目(NCET-06-0279)
