摘要
自塑封料诞生以来,逐渐以其低成本、生产工艺简单等优点逐步替代陶瓷和金属封装,成为目前功率半导体封装的主要材料。因塑封功率器件基本上都是非气密性产品,同时,由于封装所使用的塑封料也具有不同程度的吸水性问题,导致在封装过程中以及实际使用过程中产品较容易产生分层,对产品的长期可靠性有很大影响。主要讲述了塑封功率器件的分层原理及其常见的产生原因,并结合实际生产提供了改善方向。
Ceramic and metal packaging are replaced gradually, since the birth of encapsulation material for its advantages of simple production process and low cost, and become the main power semiconductor packaging materials at present. The power devices are air-tightness products basically, besides, encapsulation material that used to packaged also has inordinately different hydroseopicity problems that caused products delamination easily in the process of packaging products and actual application ,which has a great influence on long-term reliability of product. The paper mainly tells the layering principle of power device and its common cause, and also provides improvement direction according to actual production.
出处
《电子工业专用设备》
2017年第2期25-29,51,共6页
Equipment for Electronic Products Manufacturing
关键词
分层
封装
框架
塑封
Delamination： Packaging： Framework
Pastic package
