摘要
综述了溴代环氧树脂在铜箔层合板、半导体封装材料和防火剂方面的应用技术进展。
The advance in application technique of brominated epoxy resin in copperclad laminates semiconductor sealants and fireproofing agents were reviewed.
出处
《化工新型材料》
CAS
CSCD
1997年第11期12-13,26,共3页
New Chemical Materials
