摘要
介绍了环氧树脂在电子封装中的应用;环氧树脂的特点(收缩率小,耐热性好,密封性及电绝缘性优良,适用性好等)以及国外对其的技术改造(低粘度化,提高耐热性,降低吸水率)。
The application of epoxy resin to the electronic encapsulation is discussed. Epoxy resin is characterized with lesser shrinkage ratio, higher heat resistance, better sealing, higher insulation, better applicability, etc. The improvements abroad are reviewed, including lower viscosity, higher heat resistance and lower moisture absorbing ratio.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2003年第2期36-37,共2页
Electronic Components And Materials
关键词
环氧树脂
低粘度
耐热
耐湿
epoxy resin
material of encapsulation
low viscosity
heat-resistance
humidity-resistance
