摘要
以银包铜粉和环氧丙烯酸树脂为原料制备导电胶浆料,采用丝网印刷将浆料涂覆到载玻片上,置于紫外光下固化获得导电涂层。利用SEM和四探针电阻测试仪对固化后导电胶的微观结构和电学性能进行表征。结果表明:当银包铜粉质量分数为70%,导电胶固化完全,制得的导电胶电阻率最低为1.135×10^(–3)?·cm,涂层厚度为140μm。
The UV curing paste was prepared using silver-coated copper powder and epoxy acrylic resin as raw materials to study the property of UV curing conductive paste. The conductive coating was received by the UV curing of prepared paste on the glass slide by screen printing. The microstructure and electrical properties were characterized by scanning electron microscopy （SEM） and four probe resistance tester, respectively. Results show that when the mass fraction of silver coated copper powder is 70%, the resistivity of conductive paste reaches the minimum value, 1.135×10^（-3）Ω·cm, and the conductive coating thickness is 140μm.
作者
苏晓磊
张申申
边慧
SU Xiaolei ZHANG Shenshen BIAN Hui(College of Mechanical ＆ Electrical Engineering, Xi＇an Polytechnic University, Shaanxi 710048, China)
出处
《电子元件与材料》
CAS
CSCD
2017年第2期65-68,共4页
Electronic Components And Materials
基金
陕西省教育厅自然专项资助(No.15JK1314)
西安工程大学机械工程学科建设资助项目
关键词
导电胶
紫外光固化
银包铜粉
电阻率
微观结构
电学性能
conductive paste
UV curing
silver-coated copper powder
resistivity
microstructure
electrical property
