摘要
通过添加低熔点金属Sn增加渗流通路和粉末间的结合性,提高Ag@Cu低温固化导电浆料的导电性能和力学性能。采用XRD、SEM、EDS、CLSM进行物相和微观形貌表征,探讨了浆料的导电和断裂机制。结果表明,适量Sn充当粉末间“桥梁”,促进浆料固化收缩。添加30%(质量分数)Sn时浆料体积电阻率最低为2.43724×10^(-4)Ω·cm。添加15%(质量分数)Sn时浆料固化后的弯曲强度可达46.69 MPa,Sn过量则会聚集形成大颗粒与孔洞,恶化力学性能。
To improve the electrical conductivity and mechanical properties of Ag@Cu low temperature curing conductive paste,low melting point metal Sn was added to the paste to increase the seepage path and improve the bonding between powders.XRD,SEM,EDS and CLSM were used to characterize the phase and microstructure of the paste.The mechanism of conductivity and fracture was discussed.Results show that Sn acts as"bridges"between powders to promote solidification and shrinkage of slurry.Lowest resistivity is achieved at 2.43724×10^(-4)Ω·cm at 30%Sn(mass fraction).Bending strength of the paste with 15%Sn(mass fraction)can reach 46.69 MPa after curing.However,excessive Sn aggregates to form large particles and holes,which will deteriorate its mechanical properties.
作者
束长青
姚正军
杜文博
龙漫
张莎莎
SHU Changqing;YAO Zhengjun;DU Wenbo;LONG Man;ZHANG Shasha(College of Materials Science and Technology,Nanjing University of Aeronautics and Astronautics,Nanjing 210016,China;Key Laboratory of Materials Preparation and Protection for Harsh Environment,Ministry of Industry and Information Technology,Nanjing 210016,China)
出处
《电子元件与材料》
CAS
CSCD
北大核心
2022年第12期1301-1306,共6页
Electronic Components And Materials
关键词
低温固化导电浆料
力学性能
导电性能
低熔点金属
银包铜粉
low temperature curing conductive paste
mechanical properties
conductive properties
low-melting metal
silver-coated copper powder
