摘要
通过OM、XRD、TEM、SEM和拉伸试验,研究了钎焊工艺参数对SnAg0.5CuZn0.1Ni/Cu无铅微焊点界面IMC和力学性能的影响。结果表明,添加0.1%的Ni能显著细化SnAg0.5CuZn钎料合金的初生β-Sn相和共晶组织;钎焊温度为270℃、钎焊时间为240s时,钎焊接头剪切强度达到最大,为45.6 MPa;钎焊接头界面区粗糙度、金属间化合物层厚度和钎焊接头的剪切强度均随着钎焊工艺参数的变化而变化。
Effects of soldering parameters on interfacial microstructure and mechanical properties of SnAg0.5CuZn0.1Ni/Cu solder joint were analyzed by OM,XRD,SEM and electronic tensile testing machine.The results reveal that the primaryβ-Sn phase and eutectic structure of SnAg0.5CuZn solder alloy can be refined greatly with addition of 0.1%Ni.The maximum shearing strength of 45.6MPa can be obtained from the joint soldered under the soldering temperature of 270 ℃ and soldering time of 240 s.An intermetallic compounds layer was observed at the soldering interface,and the boundary roughness between the intermetallic compound layer and solder matrix,the intermetallic compounds layer thickness,and the shear strength of solder joint are varied with the soldering time or soldering temperature increase.
出处
《特种铸造及有色合金》
CAS
CSCD
北大核心
2016年第9期985-988,共4页
Special Casting & Nonferrous Alloys
基金
江苏省六大人才高峰项目资金资助项目(2011-ZBZZ-046)
关键词
钎焊
界面
金属间化合物
剪切强度
Soldering
Interface
Intermetallic Compounds
Shearing Strength
