摘要
通过对Sn0.3Ag0.7Cu/Cu和Sn3.0Ag0.5Cu/Cu焊点进行剪切测试结果表明:两种钎料焊点的剪切强度与加载速率有着明显的相关性,即焊点的剪切强度都随着加载速率的增加而增加。当加载速率为0.01 mm/s时,断裂模式为韧脆混合断裂,随着加载速率的增加,两种钎料焊点断口的韧窝数量不断增加,呈现韧性断裂特征,断口以韧窝为主。另外在相同加载速率下,Sn3.0Ag0.5Cu/Cu焊点断口的韧窝数量和分布情况都优于Sn0.3Ag0.7Cu/Cu焊点,即其韧性断裂的趋势更加明显,剪切强度更大。
It was found that the shear strength of two kinds of solder joints has obvious correlation with the loading rate based on the shear test results of the Sn0.3 Ag0.7 Cu/Cu solder joints and Sn3.0 Ag0.5 Cu/Cu solder joints. With the increase of loading rate, the shear strength gained. When the loading rate of the solder joint was 0.01 mm/s, the fracture mode was ductile- brittle mixed fracture. With the increase of the loading rate, the dimple number of shear fracture of two kinds of solder joint increase, the fractograph exhibited typical ductile dimple fracture pattern. Moreover, Sn3.0 Ag0.5 Cu/Cu solder joint fracture of dimples number and distribution situation are better than the Sn0.3 Ag0.7 Cu/Cu solder joints at the same loading rate, the ductile fracture trends more evident and shear strength
出处
《电子工艺技术》
2012年第2期75-78,共4页
Electronics Process Technology
基金
黑龙江省自然科学基金项目(项目编号:E200915)
