摘要
在28℃、3.25 A直流电下,对Cu/Sn3.0Ag0.5Cu/Cu对接无铅焊点进行原位电迁移实验,观察了通电120,168,384和504 h后焊点横截面的微观组织形貌。结果表明,电迁移初期,Cu6Sn5化合物遍布整个焊点截面,随时间延长,不断从阴极向阳极迁移聚集;当通电504 h后,焊点内已看不到金属间化合物(IMC),阴阳极出现厚度相差很大的IMC化合物层,阴极侧约8μm厚,而阳极侧约20μm厚,形成明显的极化效应。
At 28 ℃ and direct current of 3.25 A, the electromigration behavior of Cu/Sn3.0Ag0.5Cu/Cu solder joint was investigated in situ. Micrographs of cross-section of joint were observed after current acting time Of 120, 168, 384 and 504 h. Results show that Cu6Sn5 IMC spreads over all section of the joint in the early electromigration. As time goes on, IMC migrates from the cathode to the anode continuously. After current acting 504 h, there is no IMC inside solder joint, IMC layers is about 20 μm and 8 μm at the anode the cathode, respectively. The polarity effect appears at the interface obviously.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2011年第3期58-60,68,共4页
Electronic Components And Materials
基金
广东省科技计划资助项目(No.2008A080403008-04)
