摘要
为了研究无铅微焊点在尺寸效应下的可靠性,综述了微焊点的界面反应机制,常用添加元素对微连接金属间化合物(IMC)的作用及微焊点在尺寸效应下的主要问题.分析表明,IMC层主要由两种铜锡化合物Cu6Sn5和Cu3Sn组成.微焊点的连接形式有焊盘小尺寸微焊点和微通孔焊盘无铅微焊点两种,柯肯达尔(Kirkendall)孔洞、电迁移及焊料尺寸都会对接头的力学性能、拉伸强度和剪切强度造成较大的影响.同时,压力钎焊等新工艺可以促进焊料中元素的扩散,从而对抑制接头组织中脆性相和提高钎焊接头强度有显著效果.
In order to research reliabilities of lead-free micro-bump under size effect, the interface reac- tion mechanism of micro-bump, the effect of common added elements on intermetallic compound and problems of the micro-bump under size effect were presented. The analysis results show that the IMC layer is mainly composed by Cu6Sns and Ctl3Sn, connection forms of the micro-bump are small pad and micro-via-in pad lead-free solders. Kirkendall voids, electromigration and size effect have great impact on mechanical properties , shear and tensile strength of the joint. Meanwhile, pressure brazing and other new technologies can promote the diffusion of elements in the joint, thus improve the strength of joint organization by inhibitting the brittle phase.
出处
《上海工程技术大学学报》
CAS
2012年第2期111-115,共5页
Journal of Shanghai University of Engineering Science
基金
国家自然科学基金资助项目(50875160)
上海市科委攻关项目(071005120)
上海市教委重点学科资助项目(J51402)
上海工程技术大学研究生科研创新资助项目(A-2603-11-01K185)
低热输入熔钎焊过程的润湿行为和界面化学研究资助项目(12ZZ186)
关键词
金属间化合物
电迁移
尺寸效应
无铅微焊点
IMC （Intermetallic Compound）
electromigration
size effect
lead-free micro-bump
