摘要
随着电子工业的快速发展,电子产品越来越趋向于微型化、环保化和集成化。传统的电子封装材料大多是含铅焊料,具有粘度高、毒性大和实施温度高等缺点,越来越不能满足这样的趋势需求。导电胶具有粘度低、焊接精细结构,环保、成型温度低和适用范围广等优点,可以作为一种新型的绿色微电子封装互连材料取代含铅焊料。然而相对于含铅焊料,导电胶的电阻率仍然较高,接触电阻稳定性较低,抗冲击性能较差等,限制了导电胶的大规模应用。因此,科研人员和工程师一直在不断努力开发出很多方法,来提高导电胶的综合性能。针对目前的导电胶现状,详细地探讨了近几年通过对导电填料的表面进行改性来提高导电胶的综合性能的方法。
With the rapid development of electronic industry,electronic products are increasingly tending to be miniaturization,environmental protection and integration.However,the traditional electronic packaging materials mostly contain lead-solder,and have high viscosity,toxicity and temperature of implementation,more and more cannot satisfy this trend.Electrically conductive adhesives（ECAs）as a new type of friendly microelectronic encapsulation interconnect materials,have a lot of advantages such as fine structure,environmental protection,low viscosity,and low temperature of implementation and widely applicability,in future which can be used as electronic packaging materials to replace lead-solder.However,compared with lead-solder,the conductivity and contact resistance stability of ECAs is still low.To resolve the present problem of ECAs,some new methods to reduce the resistivity and improve the contact resistance stability of ECAs are introduced in detail.
出处
《材料导报》
EI
CAS
CSCD
北大核心
2015年第23期141-147,共7页
Materials Reports
基金
国家自然科学基金(51522211
51372265
51528203)
江苏省自然科学基金(BK20140392)
苏州市科技项目(ZXG201428
ZXG201401)
苏州市重点实验室(SZS201508)
关键词
电子封装
导电胶
表面改性
体积电阻率
电阻稳定性
electronic packaging
electrically conductive adhesives
surface modification
bulk resistivity
contact resistivity stability
