摘要
采用新型高分子材料聚芳基醚苯并咪唑替代传统电子封装工艺中的金属镀层 ,实现良好的界面粘接 ,并可以简化工艺 ,节约成本。利用小角光散射研究了聚芳基醚苯并咪唑与联苯四羧酸二酐二苯醚二胺型聚酰亚胺的相容性 ,利用 90°剥离试验对接合界面进行测试 ,得到剥离强度 ,并比较了相容性与界面粘接的相互关系。
Poly(arylene ether benzimidazole) (PAEBI), a new high-performance polymeric martial, serving as a primer at copper/polyimide interface in microelectronic package to replace conventional metal capping material, reached good interfacial adhesion, aiming at simplifying fabrication process and reducing cost expenditure. Small angle light scattering apparatus is employed to intensively investigate miscibility behaviors of PAEBI/poly(biphenyl dianhydride-p-phenylene diamine) (BPDA-PDA) precursors blends. 90-peel tests are performed to examine interfacial adhesion, which is reflected from the miscibility behaviors, correlation of miscibility and adhesion is discussed in this study.
出处
《高技术通讯》
EI
CAS
CSCD
2003年第3期67-70,共4页
Chinese High Technology Letters
基金
韩国教育部基础研究 (BSRI 98 3438)资助项目。
