摘要
低温共烧陶瓷(LTCC)技术是最近几年发展起来令人瞩目的电路封装技术,其质料从简略到复合、从低介电常数到高介电常数的不竭发展,技术的成熟水平、产业化水平及利用普遍水平等角度不竭增添。LTCC技术已经成为无源集成的主流技术,亦是无源元件的领域发展方向和新型电子元器件模块化主要技术之一。为迎合目前的发展趋势,本文论述了LTCC材料、LTCC技术和LTCC器件的应用以及未来市场前景。
The low temperature cofired ceramic（LTCC）technology. Its developed in recent years re- markable circuit packaging technology. Its material from simple to complex, from low dielectric con- stant maturity level to a high dielectric constant inexhaustible development, technology, the level of in- dustrialization and the use of the general level of the angle of the endless growth. LTCC technology has become the mainstream of passive integration technology. It is also the field of passive components and the development direction of new electronic components modular one of the main technologies. In order to meet the current development trend,the paper discusses the LTCC materials,applications and future market prospects and LTCC technology devices.
出处
《山东陶瓷》
CAS
2015年第4期15-18,共4页
Shandong Ceramics
基金
2014年国家大学生创新创业项目支持
关键词
低温共烧陶瓷(LTCC)技术
电路封装
无源集成
发展现状
市场前景
Keywords. Low Temperature Cofired Ceramic （LTCC） Technology Circuit Package Passive Integra-tion ~ Development Status
Market Prospects.
