摘要
低温共烧多层陶瓷（ＬＴＣＣ）基板是制造复杂微电子产品多芯片组件（ＭＣＭ）的重要部件。详细地讨论了ＬＴＣＣ基板制造工艺，介绍了多年研究之经验及国外的有关技术，还指出了目前工艺中存在的技术问题及在工艺水平上与国外的差距。采用目前工艺，可做出２０层布线、线宽及间距均为０．２０ｍｍ。
Low temperature co firing ceramic substrates (LTCC) is important for MCM The technology for LTCC is discussed, the research results and the relevant technology in the world are introduced, and the current technical problems and the gap between the industry in China and abroad are shown With the said technology, such as LTCC substrates can be made, of which the number of layer is 20, the average line and space width 0 20 mm, and the area 80 mm×80 mm (6 refs )
出处
《电子元件与材料》
CAS
CSCD
1998年第5期24-26,28,共4页
Electronic Components And Materials
