摘要
详细叙述了低温共烧陶瓷材料的生产工艺及相关技术,介绍其在多层电路模块化（Multi-Chip MOdules）设计中的特点及应用,并概要总结了LTCC相关技术的未来发展动向.
This paper reviews the producing process and relative technologies of low temperature co-fired ceramic in details. The applications and characters of LTCC in multi-chip modules circuits design are stated and the future technologies are introduced.
出处
《河北工业大学学报》
CAS
2002年第5期85-89,共5页
Journal of Hebei University of Technology
