摘要
LTCC单膜层内置腔在电容式传感器、微流系统等领域有重要应用,是3D-LTCC在微系统领域应用的典型结构类型。首先论述了目前实现内置腔制造的主流技术——牺牲层技术,并结合实验点明了该技术的关键难点。之后,提出了一种LTCC内置腔制造的新方法,并结合实验验证了该方法的可行性。新方法比牺牲层方法简便,更适合于高平整度腔膜层内置腔结构制造。
Embedded cavities with membrane in Low-temperature Co-fired Ceramic（LTCC） substrate have important applications in capacitance sensors and micro-fluidic researches. And they are typical structure in microsystem applications with 3D-LTCC technology. Firstly, the current fabrication technology, which we called the sacrificial material technology, is illustrated. Moreover, the critical and difficult points of such method are denoted. Afterwards, a novel manner to manufacture the embedded cavities with membrane is presented. And its feasibility is verified experimentally. The results reveal that, the novel manner is more simple and convenient than the sacrificial material technology, which is appropriate for LTCC embedded cavities with high demands of the membrane.
出处
《电子与封装》
2014年第6期37-40,共4页
Electronics & Packaging
关键词
低温共烧陶瓷
单膜层内置腔
制造
平整度
low-temperature co-fired ceramic（LTCC）
embedded cavities with membrane
fabrication
flatness
