摘要
文章介绍了采用LTCC技术制作微波一体化封装,重点研究了X波段LTCC一体化封装的微带穿墙结构及其微波特性。同时对封装的散热结构进行了研究,根据不同的散热要求采用不同的散热结构。采用导热孔散热的方式,其热导率与导热孔的排列方式(孔径和间距)有关,热导率可达50W(m·K)-1。封装的气密性与导热孔的结构有密切关系,热沉的焊接可大大提高封装的气密性。
The paper describes the fabrication of microwave integral substrate packaging by using LTCC. Put the emphasis on the study of X band micro strip transitions structure and characteristics in the microwave integral substrate packaging. Also the thermal disposal structure has been studied. Using different heat disposal structure according to demand, the thermal conductivity is depending on thermal via array formation （diameter and pitch of vias）. The thermal conductivity can arrive 50 W （m-K）m.The hermetic of the packaging is close related to the thermal via structure. The heat sink soldering can improve the packaging hermetic.
出处
《电子与封装》
2010年第5期1-6,共6页
Electronics & Packaging
