摘要
本文在对 ＴｉＮ、ＴｉＣ陶瓷薄膜与金属 Ａｇ、 Ｃｕ、 Ｎｉ、 Ｆｅ间的浸润性测量的基础上，用扫描电子显微镜（ＳＥＭ）、电子探针（ＥＰＭＡ）对其界面进行了观察。结果表明：浸润性较差的Ａｇ、Ｃｕ与ＴｉＮ、ＴｉＣ的界面平整，几乎没有发生相互扩散和化学反应；而浸润性较好的 Ｆｅ、Ｎｉ与 ＴｉＮ、ＴｉＣ的界面有明显的扩散和化学反应现象沿着ＴｉＮ、ＴｉＣ的晶界扩散；薄膜部分甚至全部溶入金属中。ＴｉＣ薄膜与Ｆｅ的界面反应程度大于ＴｉＮ 薄膜。
On the basis of measuring the wettability of TiN, TiC films by Ag, Cu,Ni and Fe, their interfaces have been investigated with a Scanning Electron Microscope (SEM) and an Electron Probe Micro-Analyzer (EPMA). The results show that the interfaces with bad wettability between Ag, Cu and TiN, TiN films are straight and perfact, and almost no co-diffusions and chemical reactions have been found,and that the interfaces with good wettability between Ni,Fe and TiN, TiC films have obvious co-diffusions and chemical reactions-Ni and Fe atoms diffusing along the grain boundaries of TiN and TiC and the films partly or entirely melting into the metals. The reaction between TiC and Fe is stronger than that between TiN and Fe in degrees.
出处
《真空》
CAS
北大核心
1991年第3期26-31,共6页
Vacuum
基金
国家自然科学基金资助项目
