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铜-钨/不锈钢热等静压焊接界面组织的研究 被引量:5

STUDY OF THE Cu-W AND Cu-STAINLESS STEEL HIP WELDING INTERFACE WITH SEM
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摘要 用扫描电子显微镜和能谱仪对钨和铜以及不锈钢的热等静压焊接试样的焊接界面进行了分析研究。对不同工艺条件下和不同材料的焊接界面进行了对比分析。结果发现 ,钨和铜合金的结合主要是物理结合 ,它是靠高温高压下 ,材料表面微观的凹凸不平而产生的犬齿交合结合在一起的 ,扩散结合只占很少的部分 ,铜和不锈钢的焊接界面由于添加了镍的中间层 ,因而有较好的扩散。 The SEM and EDS were used in this paper to analysis the welding interface of the specimens of tungsten and copper, copper and stainless steel made by HIP welding. The welding interface with different technology and different materials were discussed. It was found that the binding of tungsten and copper was mainly physical binding, they were jointed by high temperature and high pressure because of the not smooth of the material surface under micro dimension. The diffusion was almost not found. The welding interface of copper and stainless steel has a good diffusion because of the inserting intermediate section of nickel.
出处 《焊接》 2002年第6期13-15,共3页 Welding & Joining
关键词 铜-钨/不锈钢 接等静压 焊接界面 显微组织 偏滤器 聚变反应堆 hot isostatic pressing, welding interface, microstructure
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