摘要
简述了热等静压扩散连接技术的原理及特点,从材料体系及工艺参数的选择、计算机模拟、界面无损检测3方面阐述了该技术的研究动态,并介绍了其主要应用,最后对其发展前景进行了展望。
The principle and characteristics of HIP （hot isostatic pressing） diffusion bonding technology were brief- ly introduced in this paper. The research progress of HIP diffusion bonding was summarized in three aspects, including various material systems and technological parameters, computer simulation and nondestructive examina- tion of interface. The main application of HIP diffusion bonding was also introduced, and its future development was predicted finally.
出处
《粉末冶金工业》
CAS
北大核心
2014年第3期61-65,共5页
Powder Metallurgy Industry
关键词
热等静压
扩散连接
计算机模拟
无损检测
HIP
diffusion bonding
computer simulation
nondestructive examination
