摘要
采用扩散焊接的方法制备出加入Ni箔中间层的钨合金(93W)与锡青铜合金(QSn4-3)焊接接头样品.利用XRD,SEM和EPMA对焊接接头的物相组成和显微结构进行了分析,并测量了焊接接头样品的抗拉强度.结果表明,加镍的93W与QSn4-3进行扩散焊接时,焊接层的显微结构结合紧密,Ni与Cu元素之间以及93W合金的添加剂元素在Ni箔中分布存在明显的连续变化层.物相分析和显微硬度结果表明Ni元素与QSn4-3中的Cu元素和93W的添加剂元素的固溶反应,促进了93W/Ni/QSn4-3焊接接头强度的大幅度提高.
The 93W/Ni/QSn4-3 joint was prepared by diffusion bonding at vacuum using pure nickel foil as interface layer. The microstructure and composition were characterized by SEM and EPMA. The tensile strength of joint was also measured. The test results show that Ni foil improves the tensile strength of 93W/Ni/QSn4-3 joint. The thickness of Ni interlayer becomes thiner obviously because of the diffusion layer between Ni element of Ni foil and W and additional elements of 93W alloy,as well as the gradient layer of Ni and Cu elements. Solution reactions between Ni element of Ni foil and Cu element of QSn4-3 alloy,W and additional elements of 93W alloy achieve the joint of 93W/Ni/QSn4-3,that is why tensile strength of 93W/Ni/QSn4-3 joint welded is improved.
出处
《焊接学报》
EI
CAS
CSCD
北大核心
2009年第7期61-64,共4页
Transactions of The China Welding Institution
基金
国家自然科学基金项目(10574102)
湖北省创新群体项目(2008CDA011)
关键词
扩散焊接
钨合金
锡青铜
Ni箔
diffusion bonding
tungsten alloy
tin-bronze (QSn4-3)
nickel foil
