摘要
三维封装技术是一种符合电子系统轻重量、小体积、高性能、低功耗的发展趋势的先进的封装技术。本文对三维封装技术进行了简要介绍 ,重点介绍了三维封装的叠层工艺和互连技术 ,阐述了三维封装技术的优点 。
Three dimensional packaging technology is emerging to meet the developing of lighter,smaller,higher performance and lower power consumption systems.This paper introduces 3 D packaging technology.The stacking and interconnection techniques are described on emphasis.The advantages of 3 D packaging technology and the problems that 3 D packaging must face are discussed briefly.
出处
《微处理机》
2001年第4期16-18,共3页
Microprocessors
关键词
三维封装
裸芯片叠层
PCB
集成电路芯片
3-D packaging,bare dies stacking,MCM stacking,bump,interconnecting,3 D memory module
