摘要
随着大量电子产品朝着小型化、高密度化、高可靠性、低功耗方向发展,将多种芯片封装于同一腔体内的芯片叠层封装工艺技术将得到更为广泛的应用,其封装产品的特点就是更小、更轻盈、更可靠、低功耗。芯片叠层封装是把多个芯片在垂直方向上堆叠起来,利用传统的引线封装结构,然后再进行封装。芯片叠层封装是一种三维封装技术,叠层封装不但提高了封装密度,降低了封装成本,同时也提高了器件的运行速度,且可以实现器件的多功能化。随着叠层封装工艺技术的进步及成本的降低,多芯片封装的产品将更为广泛地应用于各个领域,覆盖尖端科技产品和应用广大的消费类产品。
The stacking-chips packaging （SCP） process technology which packages two or more chips in the same volume is getting more abroad application in the development of electronic products smaller, more compressive, more reliable, lower power-expending, because it＇s character is smaller, more light, more reliable, lower power-expending.The SCP is stacking chips on the traditional frame to package.The SCP is a solid packaging technology, it is not only improving compression, speed,but also reducing cost and earring out multi-function. The product of SCP is getting more abroad application in every field including high-tech and consumption in the development of process technology getting ahead and cost reducing.
出处
《电子与封装》
2012年第1期7-10,共4页
Electronics & Packaging
关键词
叠层封装
堆叠
曲翘度
低弧键合
SCP
stacking
bended degree
low-radian wire bonding
