摘要
目前,HASL因含铅的存在,许多人认为其工艺不久将被淘汰、取代。本文从PCB的生产实际出发,阐述了HASL未来存在的背景、趋势及其用焊料的变化,介绍了其未来用焊料的选取原则、范围及其发展前景。
Now, because HASL uses plumbic solder, many people think that its craft will be eliminated, replaced soon. Setting out physically from the PCB production, This text expatiates on the background, trend that the future of HASL can exist and its variety that solder is used, introduces its future to anticipate with the solder of select by examinations principle, scope and its development foreground.
出处
《印制电路信息》
2004年第1期50-53,共4页
Printed Circuit Information
