摘要
选用不同的有机酸作为活化剂,配制了五组助焊剂配方,使用Sn-58Bi低温无铅焊料分别进行扩展率测试,研究活化剂成分对助焊剂润湿性能的影响。研究结果表明:选用四种有机酸混合作为活化剂配制的助焊剂中,D-3和D-4两种助焊剂配方使Sn-58Bi低温无铅焊料的扩展率分别达到77.93%和78.71%,高于其它组助焊剂配方;多种有机酸类活化剂组合使用时,助焊剂具有更高的活性和助焊能力,有助于促进无铅焊料的铺展和润湿。
Various organic acids were chosen as active agents and five groups of soldering flux formulations were developed. Speading ratio test of Sn-58Bi lead-free solders were investigated by using those flux formulations. The influences on the wettingability of active agents in various soldering flux formulations were analyzed. The results show that the speading ratio of Sn-58Bi lead-free solders is 77.93% and 78.71% ,respectively by using D-3 and D-4 soldering flux formulations with four kinds of organic acids as active agents. The speading ratios are higer than the other groups of soldering flux formulations. Soldering flux formulations which used different kinds of organic acids as active agents have stronger activity and solderability, which can contribute to the spreading and wetting excellent for lead-free solder.
出处
《热加工工艺》
CSCD
北大核心
2014年第11期38-39,44,共2页
Hot Working Technology
基金
科技部中小企业技术创新基金资助项目(11C26214105167)
河南理工大学博士基金资助项目(B2009-74)
