摘要
研究了焊粉粒度分布和氧含量对锡膏稳定性的影响。试验采用Malcom粘度计测试不同保存时间锡膏的粘度变化;采用锡膏搅拌机模拟锡膏使用过程,观察锡膏状态随搅拌时间的变化。实验结果表明焊粉D50越小,所制备锡膏的使用稳定性越好,但锡膏的储存稳定性变差,锡膏呈现沙化状态;焊粉氧含量越低,所制备锡膏的储存和使用稳定性均较好。试验对搅拌沙化后的锡膏进行了金属含量测定,结果表明焊粉与助焊剂之间的化学反应是锡膏沙化的主要原因。
Effect of particle size distribution and oxygen content of solder powder on the stability of solder paste were investigated.Viscosities of solder paste with different storage time were measured by Malcom viscometer.The use of solder paste was simulated by solder paste mixer and the variation on appearance of solder paste was observed.For the same particle size range,as the median particle diameter(D50) of solder powder decreased,the in-use stability of solder paste became better,storage stability became bad...
出处
《稀有金属》
EI
CAS
CSCD
北大核心
2010年第6期865-869,共5页
Chinese Journal of Rare Metals
基金
北京市科技计划项目(2006BAE03B02)资助
关键词
粒度分布
氧含量
稳定性
particle size distribution
oxygen content
stability
