摘要
综述了Sn-Bi合金系的微观结构、润湿特性、物理及机械性能的研究进展,指出了此合金系作为软钎焊材料尚待改善的性能,采用合金化等手段可使此合金系发展为理想的低温钎焊用无铅焊料。
This paper reviews the research progress of microstructure, wettability,physical and mechanical properties of Sn-Bi-based alloys. It is pointed out that the properties of such alloys should be improved if they are used as solders. By adding alloying elements, such alloy may be developed as an alternative to Pb-based solders for low-tem-perature applications.
出处
《材料导报》
EI
CAS
CSCD
北大核心
1999年第3期23-25,共3页
Materials Reports
关键词
无铅
焊料
微观结构
机械性能
低温
锡铋合金
Pb-free solder
Sn-Bi-based alloys
microstructure
wettability
mechanical properties
