摘要
根据功率器件的气密性封装要求,设计了完整的金锡封焊工艺方法和流程,研究了工艺中的技术难点,提出了确保封装工艺稳定性和可靠性的技术要点。实验选用Au80Sn20预成型焊环作为封接材料对器件进行气密性封装。通过大量试验得出了最佳工艺曲线(包括温度、时间、气氛和压力等)。密封后的产品在经受各项环境试验和机械试验后,其结构完整性、电学特性、机械牢固性和封装气密性均能很好地满足要求,证明了采用倒置型装配的金锡封焊工艺的可行性及优越性。
According to the hermetic requirements for a power device,complete solder Sealing method and flow chart has been developed.The research work has come up with the key issues to ensure the stable and reliable packaging processes.The devices are hermetically sealed using Au80Sn20 preform.A optimized process profile such as temperature and press can be get from series of experiments.Shear test and leakage test are performed to investigate the bonding strength of the sealing structure and the hermeticity of the encapsulation.By means of our experiments,the feasibility of soldering packages using inversion assembly process was proved.
出处
《电子工艺技术》
2010年第5期267-270,共4页
Electronics Process Technology
关键词
金锡焊料
气密性封装
钎焊
倒置型装配
AuSn solder alloy
Hermetic packaging
Soldering
Inversion assembly
