摘要
对外壳镀金后常见的缺陷,如:瓷件金属化起泡、银铜焊料起泡、引线/焊环起泡、钨铜起泡、外壳镀层变色等进行了研究.采用扫描电镜和高倍显微镜对缺陷形貌进行了观察,并通过能谱分析对缺陷处元素进行了研究.通过对缺陷的分析,结合实际生产经验,提出了相应的解决办法.
The common gold plating defects on packages, such as ceramic metallization blistering, Silver-Copper solder blistering, lead/welding hoop blistering, tungsten-copper blistering, packages coating discoloration were studied. The defects were researched by using SEM and EDS. Based on the analysis of the defects and combined with the actual production experiences, the corresponding resolve methods were proposed.
出处
《复旦学报（自然科学版）》
CAS
CSCD
北大核心
2014年第2期210-214,220,共6页
Journal of Fudan University：Natural Science
关键词
电子封装
镀金
起泡
缺陷分析
electronic packaging
gold plating
blistering
defect analysis
