摘要
氮化铝陶瓷基板在化学镀镍生产过程中出现了局部区域起泡、腔体部位发黑的现象。通过故障复现试验,发现原因有二:(1)化学镀前基材钨金属化层在四周边存在亮斑色差,亮斑区域属于二次相聚集,与中间正常区域相比,钨层连续性较差,导致镀层与基材咬合力不足而起泡;(2)在烘干过程中,由于产品倒扣,腔体内部兜水,大量高温下形成的水蒸气在腔体处无法排出,氮化铝与热的水蒸气长时间接触而发生水解反应,导致腔体周围表面变黑。通过对镀前来料的筛选,并在烘干时切水和腔体朝上放置,该问题得到了解决。
Local blistering and cavity blackening occurred during electroless nickel plating on AlN ceramic substrate.Two causes were found out through fault recurrence experiment.Firstly,there exists bright spots,which results from the segregation of glass phases,on the tungsten metallization layer around the four corners of the substrate before electroless plating.As compared with the normal area in the middle,the continuity of tungsten layer is poor at these bright spot areas,resulting in the insufficient adhesion between coating and substrate.Secondly,a large amount of high-temperature water vapor is formed in the cavity during the drying process due to the cavitary face is placed downward,which cannot be discharged rapidly.The hydrolysis of AlN occurs when it is in contact with hot water vapor for a long time,thus resulting in the blackening of the surface around the cavity.The problems were solved by screening the incoming materials prior to plating,as well as by cutting water and placing the cavitary face upward during the drying process.
作者
周波
马骁
陈华三
杨磊
ZHOU Bo;MA Xiao;CHEN Huasan;YANG Lei(The 43rd Research Institute of China Electronics Technology Group Corporation,Hefei 230088,China;Hefei Shengda Electronics Technology Industry Co.,Ltd.,Hefei 230088,China)
出处
《电镀与涂饰》
CAS
北大核心
2022年第1期51-56,共6页
Electroplating & Finishing
关键词
氮化铝
陶瓷基板
化学镀镍
起泡
发黑
故障排除
aluminum nitride
ceramic substrate
electroless nickel plating
blistering
blackening
troubleshooting
