摘要
随着陶瓷封装电路密度、频率和速度不断提高,电信号噪声问题凸显。信号噪声本质上源于传输线本身存在的寄生电阻、电容、电感与电信号作用导致的一系列信号质量下降、参考电位不稳定等问题。高频高密度陶瓷电设计常见的信号噪声问题包括反射、串扰和同步开关噪声等。文章分析了陶瓷封装设计中三类噪声产生的原因、危害及解决措施,并基于信号/电源完整性理论,介绍了一款高频高密度陶瓷基板的封装电设计。
With the increasing of the density, frequency and transmission speed of ICs, the problems of electric signal noise are becoming more and more remarkable in the term of package interconnections. The substance of signal noise is the problem such as the decay of signal quality and the instability of reference voltage, which are induced by parasitic RCL of transmission line. Reflection, cross-talk and SSN are very common electrical noise problems in high-density ceramic package designing. This paper introduces causes, harm and solutions of the three SUPI problems in ceramic package designing. Based on SI/PI theories, the designing of one ceramic substrate with high density and frequency is introduced.
出处
《电子与封装》
2013年第9期1-5,共5页
Electronics & Packaging
