摘要
研究了纳米颗粒掺杂对SnAgCu无铅钎料的焊接工艺、润湿性以及显微组织的影响。结果表明,不同的纳米颗粒掺杂对钎料的焊接工艺有不同的要求。纳米颗粒掺杂能够改善焊料的润湿性,其加入也能明显细化焊点的显微组织。纳米颗粒粒径越小,对焊料的性能改善作用越大。
The effects ofnano particles doping on the soldering process, wettability and microstructure of SnAgCu lead-flee solder were investigated. The results indicate that different nanoparticles doping solder have different requirement in soldering process. The doping ofnanoparticles can improve the wettability of SnAgCu solder. The addition ofnano-particles can refine the microstructure of the solder. The smaller the particles have bigger improvement on the performance of the solder.
出处
《热加工工艺》
CSCD
北大核心
2013年第13期156-158,共3页
Hot Working Technology
