摘要
对两种无铅钎料Sn-Ag-Cu-Bi和Sn-Ag-Sb模拟封装钎焊接头的蠕变和断裂行为进行了研究,并与传统的Sn60Pb40近共晶钎料进行了对比。结果表明,两种无铅钎料的抗蠕变能力均远优于Sn60Pb40近共晶钎料,其蠕变速率低且蠕变寿命长。钎焊接头蠕变断裂后的扫描电镜分析表明,两种无铅钎料钎焊接头的蠕变断裂呈现明显的沿晶断裂特征,而Sn60Pb40钎料钎焊接头的蠕变断裂机理则为穿晶断裂。
The creep and fracture behaviors of the joints soldered by two lead-free solders,Sn-Ag-Cu-Bi and Sn-Ag-Sb,were studied,and a comparison to the traditional Sn60Pb40 solder was also researched.The results show that the two lead-free solders have much better creep resistant performance than that of the Sn60Pb40 solder,in terms of longer creep rupture lifetime and lower creep rate.The SEM inspection and analysis of the creep fractured joints show that creep fracture of the joints soldered by two lead-free solders presents obviously intergranular fracture mechanism,while creep fracture of the Sn60Pb40 soldered joint presents dominantly transgranular sliding.
出处
《焊接学报》
EI
CAS
CSCD
北大核心
2007年第2期1-4,共4页
Transactions of The China Welding Institution
基金
国家自然科学基金资助项目(50471038)
教育部"新世纪优秀人才"基金资助项目(NCET-04-0824)
关键词
无铅钎料
蠕变行为
力学性能
穿晶断裂
沿晶断裂
lead-free solder
creep behavior
mechanical properties transgranular fracture
intergranular fracture
